Shares

16 transactions
Quarter Operation Price Per share shares change shares Held SEC Form
Q2 2024

Aug 13, 2024

SELL
$9.91 - $11.94 $105,164 - $126,707
-10,612 Reduced 39.49%
16,259 $185,000
Q4 2023

Feb 12, 2024

SELL
$7.36 - $9.45 $311,732 - $400,254
-42,355 Reduced 61.18%
26,871 $252,000
Q3 2023

Nov 13, 2023

BUY
$7.27 - $8.4 $67,800 - $78,338
9,326 Added 15.57%
69,226 $520,000
Q2 2023

Aug 11, 2023

SELL
$6.74 - $8.96 $150,039 - $199,458
-22,261 Reduced 27.09%
59,900 $466,000
Q3 2022

Nov 08, 2022

SELL
$4.96 - $6.4 $576,049 - $743,289
-116,139 Reduced 58.57%
82,161 $410,000
Q2 2022

Aug 12, 2022

BUY
$5.17 - $7.3 $248,423 - $350,772
48,051 Added 31.98%
198,300 $1.03 Million
Q1 2022

May 13, 2022

BUY
$6.64 - $7.99 $72,621 - $87,386
10,937 Added 7.85%
150,249 $1.07 Million
Q4 2021

Feb 11, 2022

BUY
$6.66 - $8.1 $70,835 - $86,151
10,636 Added 8.27%
139,312 $1.09 Million
Q2 2021

Aug 16, 2021

SELL
$6.87 - $8.78 $174,978 - $223,626
-25,470 Reduced 16.52%
128,676 $1.04 Million
Q1 2021

May 13, 2021

SELL
$5.97 - $8.68 $209,373 - $304,416
-35,071 Reduced 18.53%
154,146 $1.19 Million
Q4 2020

Feb 16, 2021

SELL
$4.03 - $5.91 $64,971 - $95,281
-16,122 Reduced 7.85%
189,217 $1.11 Million
Q3 2020

Nov 13, 2020

BUY
$3.95 - $5.12 $122,430 - $158,694
30,995 Added 17.78%
205,339 $838,000
Q2 2020

Aug 14, 2020

SELL
$3.53 - $4.61 $5.36 Million - $7 Million
-1,518,161 Reduced 89.7%
174,344 $791,000
Q1 2020

May 14, 2020

BUY
$3.21 - $5.55 $4.66 Million - $8.05 Million
1,451,223 Added 601.46%
1,692,505 $6.33 Million
Q4 2019

Feb 13, 2020

BUY
$4.62 - $5.69 $895,674 - $1.1 Million
193,869 Added 408.89%
241,282 $1.34 Million
Q2 2018

Aug 13, 2018

BUY
$4.52 - $7.63 $214,306 - $361,761
47,413 New
47,413 $218,000

Others Institutions Holding ASX

About ASE Technology Holding Co., Ltd.


  • Ticker ASX
  • Exchange NYSE
  • Sector Technology
  • Industry Semiconductors
  • Shares Outstandng 2,143,859,968
  • Market Cap $21.5B
  • Description
  • ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat pac...
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