A detailed history of Cwm, LLC transactions in Ase Technology Holding Co., Ltd. stock. As of the latest transaction made, Cwm, LLC holds 19,583 shares of ASX stock, worth $201,313. This represents 0.0% of its overall portfolio holdings.

Number of Shares
19,583
Previous 16,522 18.53%
Holding current value
$201,313
Previous $189,000 1.06%
% of portfolio
0.0%
Previous 0.0%

Shares

14 transactions
Quarter Operation Price Per share shares change shares Held SEC Form
Q3 2024

Oct 08, 2024

BUY
$8.6 - $12.5 $26,324 - $38,262
3,061 Added 18.53%
19,583 $191,000
Q2 2024

Jul 09, 2024

BUY
$9.91 - $11.94 $5,668 - $6,829
572 Added 3.59%
16,522 $189,000
Q1 2024

Apr 05, 2024

BUY
$8.57 - $11.66 $27,372 - $37,242
3,194 Added 25.04%
15,950 $175,000
Q4 2023

Feb 01, 2024

BUY
$7.36 - $9.45 $1,354 - $1,738
184 Added 1.46%
12,756 $120,000
Q3 2023

Oct 11, 2023

BUY
$7.27 - $8.4 $5,256 - $6,073
723 Added 6.1%
12,572 $95,000
Q2 2023

Aug 03, 2023

SELL
$6.74 - $8.96 $12,516 - $16,638
-1,857 Reduced 13.55%
11,849 $92,000
Q1 2023

Apr 28, 2023

BUY
$6.26 - $7.97 $16,664 - $21,216
2,662 Added 24.1%
13,706 $109,000
Q4 2022

Feb 01, 2023

BUY
$4.61 - $6.8 $29,439 - $43,424
6,386 Added 137.1%
11,044 $69,000
Q3 2022

Oct 27, 2022

SELL
$4.96 - $6.4 $1,731 - $2,233
-349 Reduced 6.97%
4,658 $23,000
Q2 2022

Jul 28, 2022

BUY
$5.17 - $7.3 $13,943 - $19,688
2,697 Added 116.75%
5,007 $26,000
Q1 2022

Apr 21, 2022

BUY
$6.64 - $7.99 $8,399 - $10,107
1,265 Added 121.05%
2,310 $16,000
Q4 2021

Jan 31, 2022

BUY
$6.66 - $8.1 $2,943 - $3,580
442 Added 73.3%
1,045 $8,000
Q3 2020

Oct 19, 2020

SELL
$3.95 - $5.12 $1,177 - $1,525
-298 Reduced 33.07%
603 $2,000
Q2 2020

Jul 22, 2020

BUY
$3.53 - $4.61 $3,180 - $4,153
901 New
901 $4,000

Others Institutions Holding ASX

About ASE Technology Holding Co., Ltd.


  • Ticker ASX
  • Exchange NYSE
  • Sector Technology
  • Industry Semiconductors
  • Shares Outstandng 2,143,859,968
  • Market Cap $22B
  • Description
  • ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat pac...
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