Erste Asset Management Gmb H Ase Technology Holding Co., Ltd. Transaction History

Erste Asset Management Gmb H

  • $8.35 Trillion
  • Q3 2024
Number of Shares
0
Holding current value
$0
% of portfolio
0.0%

Shares

22 transactions
Quarter Operation Price Per share shares change shares Held SEC Form
Q3 2024

Nov 14, 2024
BUY
$8.6 - $12.5 $0 - $0
0 New
0 $0
Q2 2024

Nov 26, 2024
BUY
$9.91 - $11.94 $0 - $0
0 New
0 $0
Q1 2024

Nov 26, 2024
BUY
$8.57 - $11.66 $0 - $0
0 New
0 $0
Q4 2023

Nov 26, 2024
BUY
$7.36 - $9.45 $0 - $0
0 New
0 $0
Q3 2023

Nov 26, 2024
BUY
$7.27 - $8.4 $0 - $0
0 New
0 $0
Q2 2023

Nov 26, 2024
BUY
$6.74 - $8.96 $0 - $0
0 New
0 $0
Q1 2023

Nov 26, 2024
BUY
$6.26 - $7.97 $0 - $0
0 New
0 $0
Q4 2022

Nov 26, 2024
BUY
$4.61 - $6.8 $0 - $0
0 New
0 $0
Q3 2022

Nov 26, 2024
BUY
$4.96 - $6.4 $0 - $0
0 New
0 $0
Q2 2022

Nov 26, 2024
BUY
$5.17 - $7.3 $0 - $0
0 New
0 $0
Q1 2022

Nov 22, 2024
BUY
$6.64 - $7.99 $0 - $0
0 New
0 $0
Q4 2021

Nov 22, 2024
BUY
$6.66 - $8.1 $0 - $0
0 New
0 $0
Q3 2021

Nov 22, 2024
BUY
$7.73 - $9.59 $0 - $0
0 New
0 $0
Q2 2021

Nov 22, 2024
BUY
$6.87 - $8.78 $0 - $0
0 New
0 $0
Q1 2021

Nov 22, 2024
BUY
$5.97 - $8.68 $0 - $0
0 New
0 $0
Q4 2020

Nov 22, 2024
BUY
$4.03 - $5.91 $0 - $0
0 New
0 $0
Q3 2020

Nov 22, 2024
BUY
$3.95 - $5.12 $0 - $0
0 New
0 $0
Q2 2020

Nov 22, 2024
BUY
$3.53 - $4.61 $0 - $0
0 New
0 $0
Q1 2020

Nov 22, 2024
BUY
$3.21 - $5.55 $0 - $0
0 New
0 $0
Q4 2019

Nov 22, 2024
BUY
$4.62 - $5.69 $0 - $0
0 New
0 $0
Q3 2019

Nov 22, 2024
BUY
$4.06 - $4.69 $0 - $0
0 New
0 $0
Q2 2019

Nov 22, 2024
BUY
$3.59 - $4.84 $0 - $0
0 New
0 $0

Others Institutions Holding ASX

# of Institutions
301
Shares Held
160M
Call Options Held
113K
Put Options Held
114K
View Full List

About ASE Technology Holding Co., Ltd.

ASX Quotes by TradingView
  • Ticker ASX
  • Exchange NYSE
  • Sector Technology
  • Industry Semiconductors
  • Shares Outstandng 2,143,859,968
  • Market Cap $22B
  • Description
  • ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat pac...
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