Shares

14 transactions
Quarter Operation Price Per share shares change shares Held SEC Form
Q1 2024

May 13, 2024

BUY
$8.57 - $11.66 $2.56 Million - $3.48 Million
298,285 New
298,285 $3.28 Million
Q4 2021

Feb 11, 2022

SELL
$6.66 - $8.1 $11 Million - $13.3 Million
-1,647,885 Closed
0 $0
Q3 2021

Nov 12, 2021

BUY
$7.73 - $9.59 $12.7 Million - $15.8 Million
1,647,885 New
1,647,885 $12.9 Million
Q2 2021

Aug 13, 2021

SELL
$6.87 - $8.78 $8.78 Million - $11.2 Million
-1,278,660 Closed
0 $0
Q1 2021

May 13, 2021

BUY
$5.97 - $8.68 $2.42 Million - $3.52 Million
405,477 Added 46.44%
1,278,660 $9.85 Million
Q4 2020

Feb 10, 2021

BUY
$4.03 - $5.91 $908,946 - $1.33 Million
225,545 Added 34.83%
873,183 $5.1 Million
Q3 2020

Nov 13, 2020

SELL
$3.95 - $5.12 $2.21 Million - $2.87 Million
-559,762 Reduced 46.36%
647,638 $2.64 Million
Q2 2020

Aug 13, 2020

SELL
$3.53 - $4.61 $4.99 Million - $6.51 Million
-1,412,749 Reduced 53.92%
1,207,400 $5.48 Million
Q1 2020

May 14, 2020

BUY
$3.21 - $5.55 $1.75 Million - $3.02 Million
543,767 Added 26.19%
2,620,149 $9.8 Million
Q4 2019

Feb 13, 2020

BUY
$4.62 - $5.69 $1.44 Million - $1.77 Million
311,133 Added 17.63%
2,076,382 $11.5 Million
Q3 2019

Nov 13, 2019

BUY
$4.06 - $4.69 $962,219 - $1.11 Million
237,000 Added 15.51%
1,765,249 $7.87 Million
Q2 2019

Aug 12, 2019

BUY
$3.59 - $4.84 $726,257 - $979,132
202,300 Added 15.26%
1,528,249 $6.04 Million
Q1 2019

May 14, 2019

BUY
$3.5 - $4.37 $1 Million - $1.25 Million
286,800 Added 27.6%
1,325,949 $5.72 Million
Q4 2018

Feb 13, 2019

BUY
$3.63 - $4.85 $3.77 Million - $5.04 Million
1,039,149 New
1,039,149 $3.9 Million

Others Institutions Holding ASX

About ASE Technology Holding Co., Ltd.


  • Ticker ASX
  • Exchange NYSE
  • Sector Technology
  • Industry Semiconductors
  • Shares Outstandng 2,143,859,968
  • Market Cap $21.5B
  • Description
  • ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat pac...
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