Shares

15 transactions
Quarter Operation Price Per share shares change shares Held SEC Form
Q2 2023

Aug 02, 2023

SELL
$6.74 - $8.96 $14.4 Million - $19.2 Million
-2,137,726 Reduced 75.99%
675,605 $5.26 Million
Q4 2022

Feb 01, 2023

BUY
$4.61 - $6.8 $2.88 Million - $4.25 Million
624,764 Added 28.55%
2,813,331 $17.6 Million
Q3 2022

Oct 28, 2022

SELL
$4.96 - $6.4 $1.2 Million - $1.55 Million
-242,551 Reduced 9.98%
2,188,567 $10.9 Million
Q2 2022

Aug 04, 2022

SELL
$5.17 - $7.3 $618,962 - $873,970
-119,722 Reduced 4.69%
2,431,118 $12.6 Million
Q1 2022

May 03, 2022

BUY
$6.64 - $7.99 $1.45 Million - $1.74 Million
217,632 Added 9.33%
2,550,840 $18.1 Million
Q3 2021

Oct 27, 2021

BUY
$7.73 - $9.59 $1.07 Million - $1.32 Million
137,947 Added 6.28%
2,333,208 $18.3 Million
Q2 2021

Jul 23, 2021

BUY
$6.87 - $8.78 $3.31 Million - $4.23 Million
481,945 Added 28.13%
2,195,261 $17.7 Million
Q1 2021

Apr 27, 2021

BUY
$5.97 - $8.68 $2.78 Million - $4.05 Million
466,114 Added 37.37%
1,713,316 $13.2 Million
Q4 2020

Feb 03, 2021

BUY
$4.03 - $5.91 $518,971 - $761,072
128,777 Added 11.51%
1,247,202 $7.28 Million
Q3 2020

Oct 27, 2020

SELL
$3.95 - $5.12 $3.22 Million - $4.18 Million
-815,835 Reduced 42.18%
1,118,425 $4.56 Million
Q3 2019

Oct 23, 2019

BUY
$4.06 - $4.69 $846,493 - $977,846
208,496 Added 12.08%
1,934,260 $8.63 Million
Q1 2019

May 02, 2019

BUY
$3.5 - $4.37 $1.66 Million - $2.08 Million
475,130 Added 37.99%
1,725,764 $7.44 Million
Q4 2018

Jan 25, 2019

BUY
$3.63 - $4.85 $261,465 - $349,340
72,029 Added 6.11%
1,250,634 $4.69 Million
Q3 2018

Oct 15, 2018

SELL
$4.46 - $5.12 $1.27 Million - $1.46 Million
-285,067 Reduced 19.48%
1,178,605 $5.69 Million
Q2 2018

Jul 30, 2018

BUY
$4.52 - $7.63 $6.62 Million - $11.2 Million
1,463,672 New
1,463,672 $6.73 Million

Others Institutions Holding ASX

About ASE Technology Holding Co., Ltd.


  • Ticker ASX
  • Exchange NYSE
  • Sector Technology
  • Industry Semiconductors
  • Shares Outstandng 2,143,859,968
  • Market Cap $21.5B
  • Description
  • ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat pac...
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