Institutional shares held 105 Million
913K calls
352K puts
Total value of holdings $2.94B
$25.5M calls
$9.86M puts
Market Cap $6.85B
244,838,000 Shares Out.
Institutional ownership 42.93%
# of Institutions 430


Latest Institutional Activity in AMKR

Top Purchases

Q3 2024
Ceredex Value Advisors LLC Shares Held: 1.39M ($39M)
Q3 2024
Raymond James & Associates Shares Held: 168K ($4.71M)
Q3 2024
Cboe Vest Financial, LLC Shares Held: 49.5K ($1.39M)
Q3 2024
Lecap Asset Management LTD Shares Held: 18.6K ($521K)
Q3 2024
Wealth Enhancement Advisory Services, LLC Shares Held: 18.3K ($512K)

Top Sells

Q3 2024
Moody Aldrich Partners LLC Shares Held: 6.74K ($189K)
Q3 2024
New York State Common Retirement Fund Shares Held: 44.8K ($1.25M)
Q3 2024
Mirae Asset Global Investments Co., Ltd. Shares Held: 338K ($9.46M)
Q3 2024
Inspire Investing, LLC Shares Held: 13.5K ($377K)
Q3 2024
Amalgamated Bank Shares Held: 52.8K ($1.48M)

About AMKR

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.


Insider Transactions at AMKR

Insider Transaction List

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Date Insider Transaction Ownership Type Shares Traded Value / Price
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Last 12 Months Summary

Buy / Acquisition
32.1M Shares
From 23 Insiders
Bona fide gift 31.5M shares
Grant, award, or other acquisition 227K shares
Exercise of conversion of derivative security 358K shares
Sell / Disposition
54.6M Shares
From 29 Insiders
Bona fide gift 54.2M shares
Payment of exercise price or tax liability 68.6K shares
Open market or private sale 327K shares

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